Scholarship Opportunity: BOND Conference
The BCIA is excited to announce that we will be attending the BOND Conference as diamond sponsors. As part of our sponsorship, we are making available 2 reduced rate scholarship opportunities to those who may otherwise not be able to attend this fabulous event. Details:The Paper Factory, New York City, April 22-24, 2016 Regular rate: 597$ Scholarship recipient pays: 150$ (recipient is also responsible for travel and lodging costs. BCIA will cover the rest of the conference registration fees) One … Read More