Scholarship Opportunity: BOND Conference

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The BCIA is excited to announce that we will be attending the BOND Conference as diamond sponsors. As part of our sponsorship, we are making available 2 reduced rate scholarship opportunities to those who may otherwise not be able to attend this fabulous event.

Details:The Paper Factory, New York City, April 22-24, 2016

Regular rate: 597$ Scholarship recipient pays: 150$ (recipient is also responsible for travel and lodging costs. BCIA will cover the rest of the conference registration fees)

One scholarship shall be awarded to a BCIA business member (or their employee) and the other shall be available to someone from the larger babywearing community, if there is interest. To apply, please fill out this application before March 1, 2016.

We’re passionate about this endeavor! Read more about how and why we’re involved in BOND.